• All sections
  • H - Electricity
  • H01L - Semiconductor devices not covered by class
  • H01L 21/84 - Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices to produce devices, e.g. integrated circuits, each consisting of a plurality of components the substrate being other than a semiconductor body, e.g. being an insulating body

Patent holdings for IPC class H01L 21/84

Total number of patents in this class: 4094

10-year publication summary

491
528
488
493
417
316
213
141
177
47
2015 2016 2017 2018 2019 2020 2021 2022 2023 2024

Principal owners for this class

Owner
All patents
This class
Taiwan Semiconductor Manufacturing Company, Ltd.
36809
536
International Business Machines Corporation
60644
447
GLOBALFOUNDRIES U.S. Inc.
6459
338
Samsung Electronics Co., Ltd.
131630
185
Semiconductor Energy Laboratory Co., Ltd.
10902
143
Boe Technology Group Co., Ltd.
35384
127
Intel Corporation
45621
111
Samsung Display Co., Ltd.
30585
88
Qualcomm Incorporated
76576
83
Commissariat à l'énergie atomique et aux energies alternatives
10525
69
Renesas Electronics Corporation
6305
67
Monolithic 3D Inc.
270
67
Micron Technology, Inc.
24960
62
Semiconductor Manufacturing International (Shanghai) Corporation
1764
62
United Microelectronics Corp.
3921
60
Au Optronics Corporation
3880
58
STMicroelectronics, Inc.
886
47
Institute of Microelectronics, Chinese Academy of Sciences
1290
45
LG Display Co., Ltd.
11907
44
Shenzhen China Star Optoelectronics Technology Co., Ltd.
8635
40
Other owners 1415